Single fpc board for connecting multiple modules and touch sensitive display module using the same

ABSTRACT

A single flexible printed circuit (FPC) board for connecting multiple modules including a thin film is provided. The thin film has a first module connecting portion, a second module connecting portion and a third module connecting portion. The first module connecting portion is located on a first side of the thin film. The second module connecting portion and the third module connecting portion are located on a second side of the thin film. The first side is opposite to the second side. At least one first line is disposed between the first module connecting portion and the second module connecting portion. At least one second line is disposed between the first module connecting portion and the third module connecting portion.

This application is a continuation of U.S. patent application Ser. No.13/438,636, filed Apr. 3, 2012. This application claims the benefits ofU.S. provisional application Ser. No. 61/497,505, filed Jun. 15, 2011and Taiwan application Serial No. 100129439, filed Aug. 17, 2011, thesubject matters of which are incorporated herein by reference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The invention relates in general to a flexible printed circuit (FPC)board, and more particularly to a single FPC board for connectingmultiple modules and a touch sensitive display module using the same.

2. Description of the Related Art

Touch panels have now been widely used in various electronic products.Particularly, most display panels are equipped with a touch panel forallowing users to click or press the screen with a finger or a stylus.For example, the resistive touch panel detects the coordinates of thetouch point by sensing voltage drop, and the capacitive touch panelcalculates the coordinates of the touch point by forming a uniformelectrical field on the panel and sensing the current of the touchpoint. Then, the coordinates of the touch point are processed through aFPC board and a control circuit so as to generate an image on thedisplay panel and to provide a more convenient and user-friendlyoperating interface for the user.

Referring to FIGS. 1 and 2, a schematic diagram and an assemblystructural diagram of a conventional touch sensitive display module arerespectively shown. The touch sensitive display module 100 is formed bya display panel 110, a touch panel 120 and a motherboard 130. Thedisplay panel 110 has a first FPC board 142 and a connector 144. Thetouch panel 120 has a second FPC board 140. A cover 150 covers the touchpanel 120 disposed on the display panel 110, and the touch panel 120 andthe display panel 110 can be bonded together with a bonding adhesive.During assembly, after the second FPC board 140 is connected to thefirst FPC board 142 through the connector 144, the first FPC board 142is electrically connected to the motherboard 130 through the connector132 on the motherboard 130.

In the above assembly structure, two FPC boards 140 and 142 are used andare connected through a connector 144, and more assembly hours and alarger space are required for assembling the two FPC boards. Since twoFPC boards are used, more cost will be incurred and more wastes will begenerated in the manufacturing process.

SUMMARY OF THE INVENTION

The disclosure is directed to a single FPC board for connecting multiplemodules and a touch sensitive display module using the same. Thedisclosure allows reduction of the assembly hours of multiple modulesand the assembly space of the FPC board. In addition, the discourse canbe conformed to the thinning requirement. Moreover, the FPC board can beformed by a single thin film, hence incurring lower cost and generatingfewer wastes in the manufacturing process.

According to an aspect of the present invention, a single FPC board forconnecting multiple modules including a thin film, at least one firstline and at least one second line is provided. The thin film has a firstmodule connecting portion, a second module connecting portion and athird module connecting portion. At least one first line is disposedbetween the first module connecting portion and the second moduleconnecting portion. At least one second line is disposed between thefirst module connecting portion and the third module connecting portion.

According to another aspect of the present invention, a touch sensitivedisplay module including a first module, a second module, a third moduleand a single FPC board is provided. The second module is disposed on thefirst module. The third module is adjacent to the first module locatedbetween the second module and the third module. The single FPC boardconnects the first module, the second module and the third module.

The above and other aspects of the invention will become betterunderstood with regard to the following detailed description of thepreferred but non-limiting embodiment(s). The following description ismade with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 and 2 respectively show a schematic diagram and an assemblystructural diagram of a conventional touch sensitive display module;

FIGS. 3A-3C show assembly structural diagrams of a touch sensitivedisplay module according to one embodiment of the invention;

FIG. 4 shows a schematic diagram of a single FPC board for connectingmultiple modules according to one embodiment of the invention;

FIGS. 5A-5D respectively show assembly flowcharts of a touch sensitivedisplay module;

FIGS. 6A-6C respectively show assembly structural diagrams of a touchsensitive display module according to one embodiment of the invention;

FIGS. 7A and 7B respectively show schematic diagram of a single FPCboard for connecting multiple modules according to one embodiment of theinvention;

FIGS. 8A-8C respectively show assembly flowcharts of a touch sensitivedisplay module; and

FIGS. 9A-9B respectively show schematic diagrams of a single FPC boardfor connecting multiple modules according to one embodiment of theinvention.

DETAILED DESCRIPTION OF THE INVENTION

The single FPC board for connecting multiple modules of a presentembodiment adopts a single thin film design for connecting three or moremodules, such as a display panel, a touch panel and a motherboard fortransmitting relevant electrical signals. In one embodiment, a foldingconnection design of the single FPC board enables the lines on the thinfilm to be electrically connected between the display panel and thetouch panel. In another embodiment, a design of branch connection of thesingle FPC board enables the lines on the thin film to be electricallyconnected between the display panel and the touch panel. Thus, the lineson the thin film can be electrically connected between the display paneland the touch panel through one FPC board without using an extraconnector, so that the time for assembling the multiple modules and thespace for assembling the FPC board can be reduced and the thinningrequirement can be satisfied.

The invention is elaborated below with the exemplification of a touchsensitive display module. However, the embodiments below are forexemplification purpose only, not for limiting the scope of protectionof the invention.

First Embodiment

Referring to FIGS. 3A-3C and 4. FIGS. 3A-3C show assembly structuraldiagrams of a touch sensitive display module according to one embodimentof the invention. FIG. 4 shows a schematic diagram of a single FPC boardfor connecting multiple modules according to one embodiment of theinvention. The touch sensitive display module 200 includes a firstmodule 210, a second module 220, a third module 230 and a single FPCboard 240. The single FPC board 240 connects the first module 210, thesecond module 220 and the third module 230. The first module 210 is suchas a display panel. The second module 220, such as a touch panel, isdisposed on the first module 210. The third module 230, such as amotherboard, is adjacent to the first module 210. Preferably, the firstmodule 210 is disposed between the second module 220 and the thirdmodule 230. In one embodiment, the touch panel can be pasted on a lowersurface (as indicated in FIG. 3A) of the cover 250 according to an outcell solution; a touch-sensitive transparent conductive layer 222 (asindicated in FIG. 3B) can be formed on the cover 250 according to a oneglass solution; or, the touch-sensitive transparent conductive layer 222can be integrated onto the display panel or embedded into the displaypanel (as indicated in FIG. 3C) according to an on cell/in cellsolution.

Referring to FIG. 4, the single FPC board 240 has a single thin film241, which has a first module connecting portion 242, a second moduleconnecting portion 244, a third module connecting portion 246, a foldingportion 248 and a slot S. The first module connecting portion 242, suchas a display panel connecting portion, has multiple first bonding padsB1 such as golden fingers. Each first bonding pad B1 can be connected tothe first module 210 with a conductive glue for transmitting relevantelectrical signals. The second module connecting portion 244, such as atouch panel connecting portion, has multiple second bonding pads B2 suchas golden fingers. Each second bonding pad B2 can be connected to thesecond module 220 with a conductive glue for transmitting relevantelectrical signals. In addition, the third module connecting portion246, such as a motherboard connecting portion, has multiple thirdbonding pads B3 such as golden fingers. Each third bonding pad B3 can beelectrically connected to the third module 230 through the connector 232on the third module 230 for transmitting relevant electrical signals.The third bonding pad B3 can also be electrically connected to the thirdmodule 230 through other elements in addition to the connector 232.

Referring to FIG. 4, based on the source of the signal, the first moduleconnecting portion 242 is divided into a first signal connecting portion242 a and a second signal connecting portion 242 b which areelectrically connected to the first line 243 and the second line 245respectively. At least one first line 243 is disposed between the firstmodule connecting portion 242 and the second module connecting portion244 for transmitting a first type signal, such as a touch-sensitivesignal, which provides the sensing data of the touch position for thecontrol chip on the display panel to calculate the coordinates of thetouch position. In addition, at least one second line 245 is disposedbetween the first module connecting portion 242 and the third moduleconnecting portion 246 for transmitting a second type signal, such as adisplay panel driving signal from the third module 230 and a touchposition signal calculated by the control chip on the first module 210to the third module 230, for generating an image on the display panelaccording to the touch position signal so as to complete touch displayoperation.

Referring to FIGS. 5A-5D, assembly flowcharts of a touch sensitivedisplay module are respectively shown. As indicated in FIG. 5A, thefirst module connecting portion 242 located on a first side L1 of thethin film 241 is connected to the first module 210. As indicated in FIG.5B, the second module connecting portion 244 located on a second side L2of the thin film 241 is connected to the second module 220. Since theslot S separates the second module connecting portion 244 and the thirdmodule connecting portion 246 and the folding portion 248 is locatedbetween the first module connecting portion 242 and the second moduleconnecting portion 244, the second module connecting portion 244 can bestacked on a part of the first module connecting portion 242 through thefolding design. Meanwhile, the third module connecting portion 246located on a second side L2 of the thin film 241 is not folded. Asindicated in FIG. 5D, the third module connecting portion 246 isconnected to the connector 232 of the third module 230. Thus, theassembly procedure for assembling the touch sensitive display module 200can be completed, and the time required for assembling the multiplemodules can be reduced. The above assembly process is merely anembodiment for exemplification purpose, and the invention does not haverestrictions with respect to the procedures of the assembly process.

In the above assembly process, the second module 220 does not have to bestacked on the first module 210. The second module 220 can also bestacked under the first module 210 or be separated from the first module210 for a distance in a vertical direction. Instead of the stackingdesign, the first module 210 and the second module 220 can be disposedin parallel or separated for a distance in a horizontal direction. Inaddition, the first bonding pad B1 of the first module connectingportion 242 is not necessarily connected above the first module 210, andcan also be connected under the first module 210. The second bonding padB2 of the second module connecting portion 244 is not necessarilyconnected under the second module 220, and can also be connected abovethe second module 220. The third bonding pad B3 of the third moduleconnecting portion 246 is not necessarily connected above the thirdmodule 230, and can also be connected under the third module 230. Thesingle FPC board 240 is not limited to a rectangle as indicated in FIG.4, and can have any other shape. For example, the thin film 241 can beextended towards the second module connecting portion 244, towards thethird module connecting portion 246, towards the left side or the rightside or the two sides, or towards any combination of the above extendingdirections for increasing the bendability or application/assemblyflexibility of the single FPC board. Besides, the length and width ofthe slot S can be determined according to the needs of design andapplication. In the above exemplification, the slot S has a width.However, in practical application, the slot can be formed by cutting aline (i.e., the width can be relatively small, e.g., to nearly zero),the shape and width of the slot can have various designs, and theextending direction can be deflected. According to the needs of design,more slots can be designed for increasing the bendability orapplication/assembly flexibility of the single FPC board. Thus, theabove assembly process can be adjusted or combined according to actualneeds, and the invention does not have further restrictions.

Second Embodiment

Referring to FIGS. 6A-6C and 7A-7B. FIGS. 6A-6C respectively showassembly structural diagrams of a touch sensitive display moduleaccording to one embodiment of the invention. FIGS. 7A and 7Brespectively show schematic diagram of a single FPC board for connectingmultiple modules according to one embodiment of the invention. The touchsensitive display module 300 includes a first module 310, a secondmodule 320, a third module 330 and a single FPC board 340. The firstmodule 310 is such as a display panel. The second module 320 is such asa touch panel. The third module 330 is such as a motherboard. In oneembodiment, the touch panel can be pasted on a lower surface (asindicated in FIG. 6A) of the cover 350 according to an out cellsolution; a touch-sensitive transparent conductive layer 322 (asindicated in FIG. 6B) can be formed on the cover 250 according to a oneglass solution; or the touch-sensitive transparent conductive layer 322can be integrated onto the display panel or embedded into the displaypanel (as indicated in FIG. 6C) according to an on cell/in cellsolution.

Referring to FIGS. 7A and 7B. The single FPC board 340 has a single thinfilm 341. The thin film 341 has a first module connecting portion 342, asecond module connecting portion 344, a third module connecting portion346 and a first slot S1. The first module connecting portion 342, suchas a display panel connecting portion, has multiple first bonding padsB1 such as golden fingers. Each first bonding pad B1 can be connected tothe first module 310 with a conductive glue for transmitting relevantelectrical signals. The second module connecting portion 344, such as atouch panel connecting portion, has multiple second bonding pads B2 suchas golden fingers. Each second bonding pad B2 can be connected to thesecond module 320 with a conductive glue for transmitting relevantelectrical signals. In addition, the third module connecting portion346, such as a motherboard connecting portion, has multiple thirdbonding pads B3 such as golden fingers. The third bonding pad B3 can beelectrically connected to the third module 330 through the connector 332on the third module 330 for transmitting relevant electrical signals.The third bonding pad B3 can also be electrically connected to the thirdmodule 330 through other elements in addition to the connector 332.

Referring to FIGS. 7A and 7B. Based on the source of the signal, thefirst module connecting portion 342 is divided into a first signalconnecting portion 342 a and a second signal connecting portion 342 bwhich are electrically connected to the first line 343 and the secondline 345 respectively for transmitting different types of signals suchas a touch-sensitive signal from the second module 320 and a displaypanel driving signal/a touch position signal. The details are disclosedin the first embodiment, and the similarities are not repeated here.

The main differences between FIG. 7A and FIG. 7B are as follows: Asindicated in FIG. 7A, the thin film 341 further has a second slot S2located on a second side L2 of the thin film 341, wherein the secondslot S2 separates the first line 343 and the second line 345 forincreasing the bendability of the thin film 341. The first slot S1 andthe second slot S2 are located on different sides of the thin film 341,and the lengths of the two slots are determined according to the needsof application and can thus be the same or different from each other.For example, the lengths of the first slot S1 and the second slot S2 maybe about a half of the length of the thin film for increasing thebendability of the thin film 341. Despite the second slot S2 is notillustrated in FIG. 7B, the thin film 341 can be extended towards thesecond module connecting portion 346 for increasing the bendability ofthe single FPC board 340.

Referring to FIGS. 8A-8C, assembly flowcharts of a touch sensitivedisplay module are respectively shown. FIGS. 8A-8C are exemplified bythe single FPC board 340 of FIG. 7A, and the analogy can be applied tothe single FPC board 340 of FIG. 7B. As indicated in FIG. 8A, the firstmodule connecting portion 342 located on a first side L1 of the thinfilm 341 is connected to the first module 310. As indicated in FIG. 8B,the second module connecting portion 344 located on a first side L1 ofthe thin film 341 is connected to the second module 320. Meanwhile, thesecond module 320 stacks on the first module 310. Since the first slotS1 separates the first module connecting portion 342 and the secondmodule connecting portion 344, the branch design enables the firstmodule connecting portion 342 and the second module connecting portion344 to be located on the first module 310 and the second module 320respectively. As indicated in FIG. 8C, the third module connectingportion 346 located on a second side L2 of the thin film 341 isconnected to the connector 332 of the third module 33. Thus, theassembly procedure of the touch sensitive display module 300 can becompleted, and the time required for assembling the multiple modules canbe reduced. The above assembly process is merely an embodiment forexemplification purpose, and the invention does not have restrictionswith respect to the procedures of the assembly process.

In the above assembly process, the second module 320 does not have to bestacked on the first module 310. The second module 320 can also bestacked under the first module 310 or separated from the first module310 for a distance in a vertical direction. Instead of the stackingdesign, the first module 310 and the second module 320 can be disposedin parallel or separated for a distance in a horizontal direction. Inaddition, the first bonding pad B1 of the first module connectingportion 342 is not necessarily connected above the first module 310, andcan also be connected under the first module 310. The second bonding padB2 of the second module connecting portion 344 is not necessarilyconnected under the second module 320, and can also be connected abovethe second module 320. The third bonding pad B3 of the third moduleconnecting portion 346 is not necessarily connected above the thirdmodule 330, and can also be connected under the third module 330. Thesingle FPC board 340 is not limited to a rectangle as indicated in FIGS.7A and 7B, and can have any other shape. For example, the thin film 341can be extended towards the first module connecting portion 342 (342 aor 342 b or both), towards or opposite to the second module connectingportion 344, towards the third module connecting portion 346, towardsthe left side or the right side or the two sides, or towards anycombination of the above extending directions for increasing thebendability or application/assembly flexibility of the single FPC board.Besides, the length and width of the first slot S1 and the second slotS2 can be determined according to the needs of design and application.In the above exemplification, both the first slot S1 and the second slotS2 have widths. However, in practical applications, the slot can beformed by cutting a line (i.e. the widths of the first slot S1 and thesecond slot S2 can be relatively small, e.g., to nearly zero), the shapeand width of the slot can have various designs, and the extendingdirection can be deflected. According to the needs of design, more slotscan be designed for increasing the bendability or application/assemblyflexibility of the single FPC board. Thus, the above assembly processcan be adjusted or combined according to actual needs, and the inventiondoes not have further restrictions.

Third Embodiment

FIGS. 9A-9B respectively show schematic diagrams of a single FPC boardfor connecting multiple modules according to one embodiment of theinvention. The single FPC board 440 has a single thin film 441. The thinfilm 441 has a first module connecting portion 442, a second moduleconnecting portion 444, a third module connecting portion 446, a firstslot S1 and a second slot S2. The present embodiment is similar to thesecond embodiment, and the main differences are as follows: the firstslot S1 and the second slot S2 are located on the same side of the thinfilm 441, and the second module connecting portion 444 is locatedbetween the first slot S1 and the second slot S2.

Based on the source of the signal, the first module connecting portion442 is divided into a first signal connecting portion 442 a and a secondsignal connecting portion 442 b according to the source of the signal.The first slot S1 separates the first signal connecting portion 442 aand the second module connecting portion 444. The second slot S2separates the second signal connecting portion 442 b and the secondmodule connecting portion 444. The first signal connecting portion 442 ais electrically connected to the first line 443 for transmitting a firsttype signal such as a touch-sensitive signal. The second signalconnecting portion 442 b is electrically connected to the second line445 for transmitting a second type signal such as a display paneldriving signal.

The main differences between FIG. 9A and FIG. 9B are as follows: Asindicated in FIG. 9B, the second module connecting portion 444 furtherhas an extension portion 447 protruded from the first side L1 of thethin film 441, such that the first line 443 is extended outwards forincreasing the bendability of the thin film 441. In addition, the firstline 443 can be extended to the left or to the right for a suitablelength in cooperation with the size of the thin film 441 so that thesecond module connecting portion 444 will not be deformed when over-bentand can further be precisely fixed on the second module 220 forincreasing the assembly reliability. It is noted that in FIGS. 7A and7B, the second module connecting portion 344 can adopt similar designand be extended outside the thin film 341. The single FPC board 440 isnot limited to a rectangle as indicated in FIGS. 9A and 9B, and can haveany other shape. For example, the thin film 441 can be extended towardsthe first module connecting portion 342 (342 a or 342 b or both),towards or opposite to the second module connecting portion 344, towardsthe third module connecting portion 346, towards the left side or theright side or the two sides, or towards any combination of the aboveextending directions for increasing the bendability orapplication/assembly flexibility of the single FPC board. Besides, thelength and width of the first slot S1 and the second slot S2 can bedetermined according to the needs of design and application. In theabove exemplification, both the first slot S1 and the second slot S2have widths. However, in practical applications, the slot can be formedby cutting a line (i.e., the widths of the first slot S1 and the secondslot S2 can be relatively small, e.g., to nearly zero), the shape andwidth of the slot can have various designs, and the extending directioncan be deflected. According to the needs of design, more slots can bedesigned for increasing the bendability or application/assemblyflexibility of the single FPC board. Relevant assembly structure andassembly process of the touch sensitive display module of FIGS. 9A and9B can be obtained from the analogy of the second embodiment, and thesimilarities are not repeated here.

The single FPC board for connecting multiple modules disclosed in aboveembodiments of the invention adopts the design of single thin film forconnecting at least two modules for transmitting relevant electricalsignals. Since only one FPC board is used and the lines on the thin filmcan be electrically connected between the display panel and the touchpanel through one FPC board without using extra connector, the assemblyprocedure can be made more convenient and the time for assemblingmultiple modules can thus be reduced. The FPC board is formed by asingle thin film, and a largest number of thin films can be manufacturedif a smallest size is adopted. Therefore, unnecessary wastes can beavoided during the manufacturing process, and the cost can be furtherreduced.

While the invention has been described by way of example and in terms ofthe preferred embodiments, it is to be understood that the invention isnot limited thereto. On the contrary, it is intended to cover variousmodifications and similar arrangements and procedures, and the scope ofthe appended claims therefore should be accorded the broadestinterpretation so as to encompass all such modifications and similararrangements and procedures.

What is claimed is:
 1. A single FPC board for connecting multiplemodules, comprising: a thin film having a first module connectingportion, a second module connecting portion and a third moduleconnecting portion, wherein the first to the third module connectingportions are a display panel connecting portion, a touch panelconnecting portion and a motherboard connecting portion, respectively;at least one first line disposed between the first module connectingportion and the second module connecting portion; and at least onesecond line disposed between the first module connecting portion and thethird module connecting portion.
 2. The single FPC board according toclaim 1, wherein the first module connecting portion is located on afirst side of the thin film, the second module connecting portion andthe third module connecting portion are located on a second side of thethin film, and the first side is opposite to the second side.
 3. Thesingle FPC board according to claim 2, wherein the thin film further hasa slot separating the second module connecting portion and the thirdmodule connecting portion.
 4. The single FPC board according to claim 3,wherein the thin film further has a folding portion located between thefirst module connecting portion and the second module connectingportion.
 5. The single FPC board according to claim 1, wherein the firstmodule connecting portion is divided into a first signal connectingportion and a second signal connecting portion, which are electricallyconnected to the at least one first line and the at least one secondline, respectively.
 6. The single FPC board according to claim 1,wherein the first module connecting portion and the second moduleconnecting portion are located on a first side of the thin film, thethird module connecting portion is located on a second side of the thinfilm, and the first side is opposite to the second side.
 7. The singleFPC board according to claim 6, wherein the thin film further has afirst slot separating the first module connecting portion and the secondmodule connecting portion.
 8. The single FPC board according to claim 7,wherein the first module connecting portion is divided into a firstsignal connecting portion and a second signal connecting portion, whichare electrically connected to the at least one first line and the atleast one second line, respectively.
 9. The single FPC board accordingto claim 8, wherein the thin film further has a second slot located onthe second side of the thin film, and the second slot separates the atleast one first line and the at least one second line.
 10. The singleFPC board according to claim 8, wherein the thin film further has asecond slot located on the first side of the thin film, and the secondmodule connecting portion is located between the first slot and thesecond slot.
 11. The single FPC board according to claim 10, wherein thefirst slot separates the first signal connecting portion and the secondmodule connecting portion, and the second slot separates the secondsignal connecting portion and the second module connecting portion. 12.The single FPC board according to claim 11, wherein the second moduleconnecting portion has an extension portion protruded from the firstside of the thin film, such that the at least one first line is extendedoutwards.
 13. A touch sensitive display module, comprising: a first to athird module; and the single FPC board according to claim 1, wherein thefirst to the third module connecting portions are connected to the firstto the third modules, respectively.
 14. The touch sensitive displaymodule according to claim 13, wherein the second and the third moduleare located on top and bottom sides of the first module, respectively.15. A touch sensitive display module, comprising: a first module; asecond module disposed on the first module; a third module adjacent tothe first module, wherein the first module is located between the secondmodule and the third module; and a single FPC board connecting the firstmodule, the second module and the third module, wherein the first moduleis a display panel, the second module is a touch panel, and the thirdmodule is a motherboard.
 16. The touch sensitive display moduleaccording to claim 15, wherein the single FPC board comprises: a thinfilm having a first module connecting portion, a second moduleconnecting portion and a third module connecting portion, wherein thefirst module connecting portion is located on a first side of the thinfilm, the second module connecting portion and the third moduleconnecting portion are located on a second side of the thin film, andthe first side is opposite to the second side; at least one first linedisposed between the first module connecting portion and the secondmodule connecting portion; and at least one second line disposed betweenthe first module connecting portion and the third module connectingportion.
 17. The single FPC board according to claim 16, wherein thethin film further has a slot separating the second module connectingportion and the third module connecting portion.
 18. The single FPCboard according to claim 16, wherein the thin film further has a foldingportion located between the first module connecting portion and thesecond module connecting portion.
 19. The touch sensitive display moduleaccording to claim 16, wherein the first module connecting portion isdivided into a first signal connecting portion and a second signalconnecting portion, which are electrically connected to the at least onefirst line and the at least one second line respectively.
 20. The touchsensitive display module according to claim 15, wherein the first moduleconnecting portion and the second module connecting portion are locatedon a first side of the thin film, the third module connecting portion islocated on a second side of the thin film, and the first side isopposite to the second side.
 21. The touch sensitive display moduleaccording to claim 20, wherein the thin film further has a first slotseparating the first module connecting portion and the second moduleconnecting portion.
 22. The touch sensitive display module according toclaim 21, wherein the first module connecting portion is divided into afirst signal connecting portion and a second signal connecting portion,which are electrically connected to the at least one first line and theat least one second line, respectively.
 23. The touch sensitive displaymodule according to claim 22, wherein the thin film further has a secondslot located on the second side of the thin film, and the second slotseparates the at least one first line and the at least one second line.24. The touch sensitive display module according to claim 22, whereinthe thin film further has a second slot located on the first side of thethin film, and the second module connecting portion is located betweenthe first slot and the second slot.
 25. The touch sensitive displaymodule according to claim 24, wherein the first slot separates the firstsignal connecting portion and the second module connecting portion, andthe second slot separates the second signal connecting portion and thesecond module connecting portion.
 26. The touch sensitive display moduleaccording to claim 25, wherein the second module connecting portion hasan extension portion protruded from the first side of the thin film,such that the at least one first line is extended outwards.